Land grid arrays LGAs have two rows of pins that connect the chip to a circuit board

how big is the ATX form factorTerm

how big is the micro ATX form factor

how big is the ITX form factor

why are processor sockets important?

the socket and chipset determine which processors a board can support. they are designed to hold either an intel or an AMD processor

pin grid array. has holes aligned in uniform rows around the socket to receive the pins on the bottom of the processor. 

land grid array. has blunt protruding pins on the socket that connect with lands or pads on the bottom of the processor. 

describe a FCLGA or FCPGA

flip-chip land grid array or flip chip pin grid array. the chip is flipped over so that the top of the chip is on the bottom and makes contact with the socket. the two are not compatible

staggered pin grid array. has pins staggered over the socket to squeeze more pins into a small space

ball grid array. not really a socket. the processor is soldered to the motherboard, and the two are always urchased as a unit. 

zero insertion force socket. uses a lever to lift the processor in and out of the socket

a set of chips on the mobo that works closely with the processor to collectively control the memory, buses on the mobo, and some periphs. must be compatible with the processor it serves. usually intel or AMD

list the major intel chipsets

northbridge and south bridge; nehalem; sandy bridge; ivy bridge; haswell and broadwell

a circuit or path that enables data, instructions, and power to move from component to component on the board. 

the system of pathways used for communication and the protocol and methods used for transmission

a set of rules and standards that any two entities use for communication

traces (lines of the bus) that are used for data

the width of the data bus

what does the system clock do

a circuit dedicated to the timing of the activites on the mobo 

What is the difference b/w PCI and PCIe

PCIe uses a serial bus rather than a 32- or 64-bit bus, so it's faster. PCIe also connects to the processor differently. PCIe slots used for video cards have a direct link to the north bridge or to the processor

a card to enable one to install a PCI card to a mobo at a right angle, thus taking up less space

the plate that you install in the computer case that provides holes for the I/O ports

How would you reset the BIOS in case of a lost password

the BIOS can be reset using a jumper (a group of pins)

trusted platform module. a chip on the mobo that holds an encryption key required at startup to access encrypted data on the hard drive. windows bitlocker can use the TPM chip

complementary metal-oxide semiconductor RAM, a small amount of memory stored on the mobo that retains the data even when the computer is turned off because it is charged by a nearby lithium coin cell battery

Explain the difference between the MBR and GPT methods

master boot record allows for 4 partitions limited to 2 TB drives. GUID partition table allows for any size drive and can have up to 128 partitions; required for drives larger than 2 TB

compatibility support module. backwards compatible with devices and drivers that use BIOS

Explain how northbridge/southbridge architecture works

a hub using the accelerated hub architechture is used to connect buses. there is a fast and a slow end, each being its own chip on the mobo. the fast end is the north bridge and is connected to the processor by a 64 bit bus called the FSB. the slow end is the south bridge and connects to the north bridge so it's slower.

what does the north bridge do

it's the memory controller hub . the RAM and primary video card connect directly to it to take advantage of its fast connection to the processor

what does the south bridge do

it is the I/O controller hub. secondary pcie slots and all other I/O devices connect to it

how is nehalem different from northbridge/southbridge architecture?

RAM connects directly to the processor instead of to the north bridge, also the north bridge is connected to the processor via a quickpath interconnect rather than a FSB

a set of Intel CPU hardware enhancements improving support for virtualization

NX bit technology implemented by AMD in its CPUs

Over the years, IC (integrated circuits) have significantly evolved. Earlier on, in the 90s, ICs were super huge. However, in the 21st century, we have ICs that are downright tiny. Manufacturers utilize these tiny microscopic ICs to develop small but powerful CPUs that manage powerful computers. However, when going over this topic on CPUs, you will likely come across words such as LGA, PGA, and BGA. These terms, which we shall discuss later on, describe various types of IC packages. However, these packages bear differences that breed variation. But are these differences that we are talking about? And out of the three, which is the best IC to utilize?

Ball Grid Array

Ball Grid Array (BGA) packages utilize tiny solder balls to form connections. These balls follow a square grid arrangement consisting of rows and columns on the backside of an IC. Due to this design, these packages can form high-density connections. The connections are so many such that they can even double the number of connections made on PGA packages.

BGA solder balls offer short connections, which leads to a chipset with impeccable performance.

Advantages of utilizing BGA packages

BGA packages have the following benefits:

1. Optimal space utilization – BGA packages are tiny. They hence take up less space. However, their small size does not lower their performance. Therefore, you can generate tiny gadgets that are super powerful using this incredible Package.
2. Heat dissipation – BGA packages dissipate heat impeccably. Therefore, they rarely overheat.
3. Low impedance – BGA packages have low impedance because of the short lead connection paths. The packages are hence able to propagate signals pretty fast.
4. Easy to unsolder – BGA packages are super easy to unsolder. The unsoldering process is also efficient such that it does not damage the BGA package or the PCB.
5. Deballing is made possible – BGA packages let you remove old, worn-out solder balls via a process known as deballing. In doing so, you optimize your BGA to produce excellent outputs.
6. Reballing – BGA packages let you populate your Package with new solder balls through a process known as reballing.
7. Portability – BGA chips are portable. That means that you can eject them from one device and mount them onto another device, and they will still function well.
8. Impeccable thermal and mechanical properties – BGAs have impeccable thermal and mechanical properties. Due to these properties, you can utilize this gadget as a CPU for your computer.

Disadvantages of utilizing BGAs

pin grid array

Even though BGAs have a lot of advantages, they still have some disadvantages. These disadvantages include:

1. Solder inspection – To inspect BGA solder joints, you must utilize x-rays. That is because these packages use their bottom side to make connections making it hard to access the component-to-PCB link.
2. Hard to repair – the access limitation factor greatly hinders the repair process. To carry out BGA repair, you must utilize special equipment and skills.
3. Challenging to solder – To solder BGA packages onto PCBs, you have to utilize special equipment.
4. Application limitation – BGA packages only work on multi-layer circuit boards. They, therefore, have limited applications.

Pin Grid Array (PGA)

Pin Grid Array (PGA) are IC packages that manufacturers mostly utilize to make processors solely. While BGAs utilize solder balls to create connections, PGAs utilize tiny pins to do the same.

PGAs also arrange their pins in a square grid that features rows and columns. However, the array arrangement and the amount of connection made vary. Therefore, PGA has a lot of variants and hence varying CPU sockets.

PGA pen rows are arranged offset or in parallel. These pen rows are labeled, and you can pinpoint them using unique letters and numbers.

PGA Types

1. Ceramic Pin Grid Array (CPGA) – CPGAs feature a semiconductor chip fixed onto a ceramic carrier that conducts heat. Intel Pentium first-generation CPUs were made out of these packages.
2. Plastic Pin Grid Array (PPGA) – In PPGA, the semiconductors chip carrier is a plastic component. These package variations are cheap, and they have impeccable thermal properties when you compare them with other PGAs. They also have better electrical performance when you compare them with ceramics.

PPGA application areas over the years include:

• Application in the Celeron processor
• Application in the Pentium MMX CPU
• Staggered Pin Grid Array (SPGA) – SPGAs feature connection rows that are “staggered.” These PGA variations are significant for CPUs that bear more than two hundred connections. That is because the layout of the offset provides more space.

SPGA application areas include:

• In the Pentium process
• Modern CPUs
• Flip Chip Pin Grid Arrays (FCPGA) – In this package variation, the IC attaches onto the carrier’s top.

The application areas of this Package over the years include:

• Application in the Pentium III
• Application in some Celeron CPUs

Since PGAs feature pins, circuit boards that utilize these packages feature holes. The pins go through their corresponding holes, creating a connection. Since the holes are pre-made, this process does not need much pressure.

Land Grid Array (LGA)

Land Grid Array packages and PGAs are two opposite sides of the same coin. What this means is that these two components do the same job, but they have different connection designs.

In LGAs, contact pins protrude from the mainboard’s base. The CPU, on the other hand, features contact points that match those of the circuit board. To create a connection, merge the pins to their corresponding points, and you are all set.

Application areas of this Package over the years include:

1. In Celeron CPUs
2. In Pentium CPUs
3. And lastly, in Xeon CPUs

Advantages of utilizing LGAs

Advantages of utilizing LGAs include:

1. The chip size – LGAs are tiny. Hence, they are space-efficient, and you can utilize them to create small, powerful gadgets.
2. Pin size – LGA pins are super small. That means that you can easily fit many pins on a small area.
3. Not prone to damage – LGA pins are on the circuit board. On the other hand, the sockets bear points that are not prone to damage.

PGAs VS LGAs

PGA contact pins protrude from the socket; this makes the circuit board less prone to damage. On the other hand, in LGA, contact pins protrude from the circuit board, making it more prone to damage.

Another difference is that repairing pins in PGA packages is easier than repairing pins in LGA packages.

Conclusion

LPA PGA and BGA are incredible IC packages that have been in the tech market for years. Of course, these packages bear advantages and disadvantages. However, overall their performances have led to the tech evolution. Now you can utilize small and powerful devices such as phones to carry out complex computations.

Related posts:

1. Different Types of BGA (Ball Grid Array) Packages
2. Ball Grid Array (BGA) advantages disadvantages and its types
3. The Ball Grid Array (BGA) Printed Circuit Boards (PCBs)
4. What’s the Difference between EMI EMS and EMC ?